Coolpad, the Chinese mobile phone giant, announced their latest flagship – the Coolpad Max – in India today. The phone will be available for INR 24,999 on amazon.in starting May 30th.
The Coolpad Max was released in China last year, and in Indonesia earlier this month. The variant released in India is the 4GB RAM + 64GB ROM one which is kind of the in-the-middle variant in China. Apart from this, the phone also features a 5.5-inch display with full HD resolution protected by Gorilla glass 4, a Snapdragon 617 chipset, a 13mp rear and 5mp front camera, and a 2800mAh battery.
Coolpad Max is 7.6mm thin and only 170g in weight with an Edge Curved Glass 2.5D screen reinforced with Corning Gorilla Glass 4 anti-scratch and anti-fingerprint coating films. The chassis of the smartphone carries a very thin 1.4mm dual-antenna line (thinner than other smartphones, i.e. 2.0mm). The phone has quick charge 3.0 feature, through which one could charge the battery up to 65% in 30 minutes.
In order to improve security for its users, Coolpad also added the latest fingerprint technology that can deliver convenience, security, and reliability on Coolpad Max. The fingerprint feature not only enables faster unlocking of the smartphone, but also allows users to use it for App Shortcut, Quick Capture, One Key Dial, Switch Space, and many more!
But the coolest feature on the phone is probably the Dual In One technology. Coolpad Max comes with a unique dual-system, an external open system as well as an internal security system which allows for encryption of the phone user’s calls and texts. The secure internal system can be used to download ‘fully secure’ apps in a way that the users’ privacy and security aren’t compromised. Also the phone comes with a distinctive Space management capability that enables users to have two accounts on WhatsApp, Facebook, Messenger and other apps. This feature can assist those people, who want to keep their personal and professional lives separate, and at the same time eliminate use of two smartphones.
Coolpad holds 13 patents in developing Tridimensional Coupling Antenna technology. Ultra-thin 1.4mm dual-antenna lines on the phone chassis offer up to 60% stronger signal transmission and up to 30% better signal reception.